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 Applications  >  Hollow Gasket Dispensing - Patent Pending  >  Filled Gasket Dispensing - Insulated Wires 
 

Filled Gasket Dispensing - Insulated Wires

Back To Hollow Gasket Dispensing - Patent Pending

The same technology that allows for hollow gasket dispensing allows for a simple transition to filling the hollow with something other than air.  Currently in our trials we have filled the hollow with black RTV.  As the outer "insulator" is transparent, the consistency becomes readily verifiable.
This represents a step forward from our previous work done back in 2006 with dispensing conductive traces on acetate sheet.
While the photos show a single conductor, multiple conductors are possible and our trials have been successful with up to seven conductors.

Please note that electrical connections to these wires present certain challenges!  Potential interconnect methods are:
1)  Pierced wires (insulation displacement style interconnect)
2)  Snap style (YKK Snapet Ligne 14 for example)
3)  Z axis conductive adhesives
4)  Embedded and encapsulated one-time-use electronics.

As it is also possible to multiple spaced conductors with a hollow center, it becomes possible to implement a clamping ring vis-a-vis the Imperial Eastman pneumatic fitting.
All if these methods however would require further encapsulation to preserve the interconnect.  

    Images

  1. side view of conductive trace - note the conductor position at the joint
  2. Micro gasket filled with RTV
  3. Loop with cutout
    Links

  1. Jump to our previous work with conductive traces

 Applications  >  Hollow Gasket Dispensing - Patent Pending  >  Filled Gasket Dispensing - Insulated Wires 
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